Ordering Information

SC-901-I/S

For Strip/Lead Frame, 4-Stainless Wire Indexer, 0~3mm Heating Height I: In-Line Type S: Stand-Alone Type

SC-902-I/S

For Power IC Strip, 232(W) x 55(D)x 0.8(t)mm

SC-903-I/S

For Standard Boat Type, 260 (W) x 75(D) x 0.8 (t)mm

SC-904-I/S

For Reflow Oven Type, 10 Curing Stations

Feature

1.      Fully automatic curing system for fast-cure glue.

2.      Easy to connect with kinds of Die-Bonder machine.

3.      Suitable for different type of packaging without change kits.

4.      Dual languages (Chinese/English) operation interface and Windows based on MMI, easy to operation.

Application

1.      Die-Bonding and curing process in-line purpose.

2.      Die-Bonding process of package Stacking Dies

3.      Pre-Heating/Pre-Heating of Flip-Chip Under-Fill process.

Specifications

Substrate

120~260(W)x 45~90(D)mm

Throughput

720 ea/hour (Curing Time 3sec + Index Time)

Heating

PID Control Curing Stations

Transfer

Wire / Strip Indexer

Magazine

Max. 270(W)x 90(D)x 160(H)mm

Facilities

220 VAC / 1 Phase/60Hz, Air: 5kg/cm2(min.)

Dimensions

Ref. 1130(W) x 1270(D) x 1640(H) mm

Weight

Approx. 650kg