Nordson DAGEs versatile Xi3400 Automated X-ray Inspection System (AXI) offers complete inspection
of solder joints and other critical hidden features found in electronic assemblies, PCBs and packaged
semiconductors. Ideal for in-line or off-line operation, the Xi3400s innovative algorithms enable fast and
reliable automated inspection and real-time monitoring of critical process information.

By leveraging the automation software techniques developed at Nordson YESTECH and combining with
Nordson DAGE hardware technology, including the patented Digitial Tomosynthesis Technology, the Xi3400
acquires multiple images in different slice heights in one inspection cycle. The images can discriminate between
components on the top and bottom slices of double sided boards for unimpeded automated inspection.
The utilization of standard package libraries simplify training and ensure program portability across
manufacturing lines. Newly available image processing technology integrates several techniques and inspection
algorithms, to provide complete inspection coverage with an extremely low false failure rate.
The Xi3400 is the latest addition to Nordsons comprehensive range of test and inspection equipment
for electronic device manufacturers and related applications.